(CEI)Īdvanced post-processing and visualization Transistor-level simulation for semiconductor IP and system-on-chip (SoC) designsĬomputational Engineering International, Inc. Newmerical Technologies International Inc.
ANSYS PITTSBURGH SOFTWARE
Simulating interactions between software and hardwareĬloud-based software for engineering composites Simulating cooling and temperature in electronics
In February 2000, Jim Cashman was appointed CEO.
įrom 1996 to 2000, profits at Ansys grew an average of 160 percent per year. However, revenue from services increased stronger. In the late 1990s, Ansys shifted its business model away from software licenses, and corresponding revenue declined. īy 1997, Ansys had grown to $50.5 million in annual revenue. Īnsys went public in 1996, raising about $46 million in an initial public offering. Peter Smith was appointed CEO and SASI was renamed after the software, Ansys, the following year. In 1993, Swanson sold his majority interest in the company to venture capitalist firm TA Associates. In 1992, SASI acquired Compuflo, which marketed and developed fluid dynamics analysis software. According to The Engineering Design Revolution, the company became "well-respected" among engineering circles, but remained small. History īy 1991 SASI had 153 employees and $29 million in annual revenue, controlling 10 percent of the market for finite element analysis software. Westinghouse also became the first Ansys user.
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Westinghouse hired Swanson as a consultant, under the condition that any code he developed for Westinghouse could also be included in the Ansys product line. Swanson developed the initial Ansys software on punch-cards and used a mainframe computer that was rented by the hour. (SASI) the next year, working out of his farmhouse in Pittsburgh. He founded Ansys under the name Swanson Analysis Systems Inc. Westinghouse rejected Swanson's idea to automate FEA by developing general purpose engineering software, so Swanson left the company in 1969 to develop the software on his own. At the time, engineers performed finite element analysis (FEA) by hand. The idea for Ansys was first conceived by John Swanson while working at the Westinghouse Astronuclear Laboratory in the 1960s. Tack Chair Professor & MEMS Department Chair (High-temperature Corrosion Materials) Dr. Guofeng Wang, Associate Professor (First-Principles Based Materials Modeling) Dr. Hessam Babaee, Assistant Professor (Reduced-Order Modeling, Uncertainty Quantification) Dr. Wei Xiong, Assistant Professor (CALPHAD Based Materials Design) Dr. Minking Chyu, Leighton and Mary Orr Chair Professor & Associate Dean for International Initiates (Heat Transfer, Turbine Design) Dr. Albert To ( CNG Associate Professor & Director of MOST-AM Consortium (Topology Optimization, Constitutive Modeling) Dr.
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More information can be found below regarding membership benefits, fees, and how to join.įACULTY MEMBERS Dr.
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These meetings include presentations and panel discussions, as well as provide a great opportunity for members to interact with each other.īy joining the MOST-AM Consortium, the member will not only gain access to the latest research results, but also will be provided license to the beta-version of any new ANSYS simulation capabilities for AM. The Consortium will hold meetings to present current research progress, discuss research needs, and select projects. To achieve these goal, the Consoritum leverges not only the ANSYS gift and membership fees, but also a number of research projects at Pitt that have been funded by government agencies such as America Makes, NSF, NASA, Army, etc.
The goals of the Consortium for the next five years include 1) developing process modeling technology to reduce AM build failure, 2) developing topology optimization solutions accepted by industry, and 3) enabling simulation-based certification of AM metal parts via process-microstructure-property modeling. Through a generous gift from ANSYS, the Consortium is now being launced by Professor Albert To. The MOST-AM Consortium is a public-private partnership aiming at developing the most advanced modeling and simulation tools for additive manufacturing (AM).